Stand-Alone Machines

Our stand-alone laser machines offer maximum flexibility and safety, as they are fully designed to Laser Class 1 standards. These systems are equipped with scanner technology, an extended working area, various wavelengths, and camera observation, making them ideal for a wide range of processing tasks.

Advantages for larger workpieces

Thanks to their larger working areas compared to tabletop devices, stand-alone machines can process larger workpieces, increasing productivity in series production or when working with complex parts. The machines can also be adapted to different materials and processes and operate with CW or pulsed lasers, with pulse lengths down to the picosecond range for maximum precision.
Another advantage of this product category is automation: The systems can be configured to automatically control the entire process, from workpiece detection to processing. This enables efficient, repeatable production.
Examples of our stand-alone machines with automation options can be found under the link: Stand-Alone Machines with Automation.

Advantages through automation

Another advantage of this product category is automation: the systems can be configured to automatically control the entire process from workpiece detection to machining. This enables efficient and repeatable production.

Equipment in this category is designed in accordance with laser class 1 as a stand-alone system with a focus on automation.

LTBS 2

The system has been developed for cutting and marking non-flammable materials. The processing of several parts is fully automated. First, image recognition is used to determine the position. The positions determined are then used to mark and cut the part.

LMBS UV

The system enables particle-free labeling and marking of medical equipment.
After an application, the quality of the labeling and marking is checked. This is checked using image recognition and subsequent measurement of the equipment. The system was developed for use in clean rooms.

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Available machine configurations

Our versatile machine configurations offer flexible solutions for a wide range of requirements. Each machine is designed for efficiency, precision and ease of use to optimize your production processes.

Stand S

Dimensions (WxDxH)	700 x 700 x 2200
Laser types	UV, Vis, IR, FIR CW bis Picosecond
Editing field	up to 500 x 500 mm
Height adjustment	up to 700 mm
Configurations	All

Stand M

Dimensions (WxDxH)	1200 x 1000x 2300
Laser types	UV, Vis, IR, FIR CW bis Picosecond
Editing field	up to 1000 x 800 mm
Height adjustment	up to 700 mm
Configurations	All

Stand L

Dimensions (WxDxH)	1700 x 1200 x 2300
Laser types	UV, Vis, IR, FIR CW bis Picosecond
Editing field	up to 1500 x 1000 mm
Height adjustment	up to 700 mm
Configurations	All

Stand XL

Dimensions (WxDxH)	2300 x 1500 x 2500
Laser types	UV, Vis, IR, FIR CW bis Picosecond
Editing field	up to 2000 x 1200 mm
Height adjustment	up to 1000 mm
Configurations	All